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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    24-6572-11

    24-6572-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,655
    RFQ
    		24-6572-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    24-6570-11

    24-6570-11

    CONN IC DIP SOCKET ZIF 24POS GLD

    Aries Electronics

    		 2,016
    RFQ
    		24-6570-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    24-3575-11

    24-3575-11

    CONN IC DIP SOCKET ZIF 24POS TIN

    Aries Electronics

    		 3,116
    RFQ
    		24-3575-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    116-43-324-61-001000

    116-43-324-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,531
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-624-61-001000

    116-43-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,307
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-424-61-001000

    116-93-424-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,943
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-624-61-001000

    116-93-624-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,792
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-964-41-007000

    116-93-964-41-007000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,131
    RFQ
    		116-93-964-41-007000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-964-41-007000

    116-43-964-41-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,283
    RFQ
    		116-43-964-41-007000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    115-93-648-61-003000

    115-93-648-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,019
    RFQ

    -

    		 115 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-324-61-801000

    110-43-324-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,247
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-632-61-003000

    116-43-632-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,179
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-432-61-003000

    116-93-432-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,150
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-632-61-003000

    116-93-632-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,217
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-91-964-61-001000

    110-91-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,633
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    104-13-952-41-780000

    104-13-952-41-780000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,514
    RFQ
    		104-13-952-41-780000

    Datasheet

         		104 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) - Gold Thermoplastic 10.0µin (0.25µm) Brass Alloy
    612-11-650-41-001000

    612-11-650-41-001000

    SKT CARRIER SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,671
    RFQ
    		612-11-650-41-001000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) - - Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    510-93-114-13-062001

    510-93-114-13-062001

    PGA SOCK 114PIN 13X13 SOLDER TL

    Mill-Max Manufacturing Corp.

    		 4,810
    RFQ

    -

    		 510 Tube Active PGA 114 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    126-93-648-41-003000

    126-93-648-41-003000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,039
    RFQ
    		126-93-648-41-003000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-43-648-41-003000

    126-43-648-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,766
    RFQ
    		126-43-648-41-003000

    Datasheet

         		126 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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