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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    28-3575-11

    28-3575-11

    CONN IC DIP SOCKET ZIF 28POS GLD

    Aries Electronics

    		 4,867
    RFQ
    		28-3575-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    28-6575-11

    28-6575-11

    CONN IC DIP SOCKET ZIF 28POS TIN

    Aries Electronics

    		 2,061
    RFQ
    		28-6575-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    126-93-950-41-002000

    126-93-950-41-002000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,708
    RFQ
    		126-93-950-41-002000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    126-43-950-41-002000

    126-43-950-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,358
    RFQ
    		126-43-950-41-002000

    Datasheet

         		126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0610-G-2

    HLS-0610-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,664
    RFQ
    		HLS-0610-G-2

    Datasheet

         		HLS Bulk Active SIP 60 (6 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    124-93-648-41-002000

    124-93-648-41-002000

    CONN IC DIP SOCKET 48POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,243
    RFQ
    		124-93-648-41-002000

    Datasheet

         		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-43-648-41-002000

    124-43-648-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,227
    RFQ
    		124-43-648-41-002000

    Datasheet

         		124 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    34-3503-21

    34-3503-21

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    		 3,403
    RFQ
    		34-3503-21

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    34-3503-31

    34-3503-31

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    		 2,333
    RFQ
    		34-3503-31

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    110-93-320-61-105000

    110-93-320-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,459
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-420-61-105000

    110-93-420-61-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,295
    RFQ

    -

    		 110 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APH-0918-G-T

    APH-0918-G-T

    APH-0918-G-T

    Samtec Inc.

    		 4,097
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1418-G-T

    APH-1418-G-T

    APH-1418-G-T

    Samtec Inc.

    		 2,601
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0518-G-T

    APH-0518-G-T

    APH-0518-G-T

    Samtec Inc.

    		 4,716
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1018-G-T

    APH-1018-G-T

    APH-1018-G-T

    Samtec Inc.

    		 4,776
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1518-G-T

    APH-1518-G-T

    APH-1518-G-T

    Samtec Inc.

    		 4,730
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1718-G-T

    APH-1718-G-T

    APH-1718-G-T

    Samtec Inc.

    		 4,321
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0418-G-T

    APH-0418-G-T

    APH-0418-G-T

    Samtec Inc.

    		 2,415
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    614-93-964-31-012000

    614-93-964-31-012000

    SOCKET CARRIER LOWPRO .900 64POS

    Mill-Max Manufacturing Corp.

    		 3,116
    RFQ
    		614-93-964-31-012000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-43-964-31-012000

    614-43-964-31-012000

    SKT CARRIER PGA

    Mill-Max Manufacturing Corp.

    		 3,333
    RFQ
    		614-43-964-31-012000

    Datasheet

         		614 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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