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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    32-C300-21

    32-C300-21

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,293
    RFQ
    		32-C300-21

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    32-C300-31

    32-C300-31

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,715
    RFQ
    		32-C300-31

    Datasheet

         		EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    612-13-650-41-001000

    612-13-650-41-001000

    SOCKET CARRIER SLDRTL .600 50POS

    Mill-Max Manufacturing Corp.

    		 4,698
    RFQ
    		612-13-650-41-001000

    Datasheet

         		612 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    42-3551-11

    42-3551-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 4,341
    RFQ
    		42-3551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    42-3552-11

    42-3552-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 2,614
    RFQ
    		42-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    42-6551-11

    42-6551-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 4,047
    RFQ
    		42-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    42-6552-11

    42-6552-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 4,392
    RFQ
    		42-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold - Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled - Beryllium Copper
    510-41-069-11-061001

    510-41-069-11-061001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,818
    RFQ
    		510-41-069-11-061001

    Datasheet

         		510 Bulk Active PGA 69 (11 x 11) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    510-93-128-13-041001

    510-93-128-13-041001

    SOCKET SOLDERTAIL 128-PGA

    Mill-Max Manufacturing Corp.

    		 2,914
    RFQ

    -

    		 510 Tube Active PGA 128 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    32-6508-211

    32-6508-211

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 4,119
    RFQ
    		32-6508-211

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    32-6508-311

    32-6508-311

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 3,849
    RFQ
    		32-6508-311

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
    110-44-964-61-001000

    110-44-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,889
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Tin 100.0µin (2.54µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-41-950-61-001000

    110-41-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,895
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-93-950-41-001000

    116-93-950-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,808
    RFQ
    		116-93-950-41-001000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    116-43-950-41-001000

    116-43-950-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,355
    RFQ
    		116-43-950-41-001000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    122-13-652-41-001000

    122-13-652-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,352
    RFQ
    		122-13-652-41-001000

    Datasheet

         		122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    116-43-648-61-006000

    116-43-648-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,699
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0510-G-11

    HLS-0510-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,436
    RFQ
    		HLS-0510-G-11

    Datasheet

         		HLS Bulk Active SIP 50 (5 x 10) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    116-43-640-61-007000

    116-43-640-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,083
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    40-8750-610C

    40-8750-610C

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    		 3,106
    RFQ
    		40-8750-610C

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Gold Polyamide (PA46), Nylon 4/6, Glass Filled 10.0µin (0.25µm) Brass
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