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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1420-G-T

    APH-1420-G-T

    APH-1420-G-T

    Samtec Inc.

    		 4,423
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0620-G-T

    APH-0620-G-T

    APH-0620-G-T

    Samtec Inc.

    		 2,148
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1720-G-T

    APH-1720-G-T

    APH-1720-G-T

    Samtec Inc.

    		 4,475
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0320-G-T

    APH-0320-G-T

    APH-0320-G-T

    Samtec Inc.

    		 4,928
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    121-13-950-41-001000

    121-13-950-41-001000

    CONN IC DIP SOCKET 50POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,213
    RFQ
    		121-13-950-41-001000

    Datasheet

         		121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-41-964-41-001000

    116-41-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,282
    RFQ
    		116-41-964-41-001000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-91-964-41-001000

    116-91-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,773
    RFQ
    		116-91-964-41-001000

    Datasheet

         		116 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-650-61-006000

    116-43-650-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,019
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-43-636-61-008000

    116-43-636-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,779
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-636-61-008000

    116-93-636-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,837
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    416-93-264-41-008000

    416-93-264-41-008000

    SOCKET DUAL INLINE ELEVATD 64POS

    Mill-Max Manufacturing Corp.

    		 3,849
    RFQ
    		416-93-264-41-008000

    Datasheet

         		416 Tube Active DIP, 0.1" (2.54mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - - Closed Frame - - - - - - -
    116-43-420-61-001000

    116-43-420-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,730
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-320-61-001000

    116-93-320-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,107
    RFQ

    -

    		 116 Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-420-61-001000

    116-93-420-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,345
    RFQ

    -

    		 116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-636-61-001000

    111-43-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,406
    RFQ

    -

    		 111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-636-61-001000

    111-93-636-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,995
    RFQ

    -

    		 111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-91-064-10-051003

    510-91-064-10-051003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,754
    RFQ
    		510-91-064-10-051003

    Datasheet

         		510 Bulk Active PGA 64 (10 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-93-428-61-005000

    117-93-428-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,786
    RFQ

    -

    		 117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-41-964-41-002000

    124-41-964-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,668
    RFQ
    		124-41-964-41-002000

    Datasheet

         		124 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    124-91-964-41-002000

    124-91-964-41-002000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,982
    RFQ
    		124-91-964-41-002000

    Datasheet

         		124 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
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