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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    116-43-624-61-008000

    116-43-624-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,071
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    44-3551-11

    44-3551-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 2,199
    RFQ
    		44-3551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3552-11

    44-3552-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 2,784
    RFQ
    		44-3552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3553-11

    44-3553-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 2,320
    RFQ
    		44-3553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6551-11

    44-6551-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 4,250
    RFQ
    		44-6551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-3554-11

    44-3554-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 3,286
    RFQ
    		44-3554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6554-11

    44-6554-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 4,683
    RFQ
    		44-6554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6508-212

    32-6508-212

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,554
    RFQ
    		32-6508-212

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    32-6508-312

    32-6508-312

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    		 2,724
    RFQ
    		32-6508-312

    Datasheet

         		508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    116-43-640-61-008000

    116-43-640-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,960
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-133-14-071001

    510-93-133-14-071001

    CONN SOCKET PGA 133POS GOLD

    Mill-Max Manufacturing Corp.

    		 3,624
    RFQ
    		510-93-133-14-071001

    Datasheet

         		510 Tube Active PGA 133 (14 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    117-93-430-61-005000

    117-93-430-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,241
    RFQ

    -

    		 117 Tube Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-422-G-H

    APO-422-G-H

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,330
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    38-3503-21

    38-3503-21

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    		 2,929
    RFQ
    		38-3503-21

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    38-3503-31

    38-3503-31

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    		 2,657
    RFQ
    		38-3503-31

    Datasheet

         		503 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    HLS-0220-G-18

    HLS-0220-G-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,496
    RFQ
    		HLS-0220-G-18

    Datasheet

         		HLS Tube Active SIP 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    122-13-640-41-801000

    122-13-640-41-801000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,509
    RFQ
    		122-13-640-41-801000

    Datasheet

         		122 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-80-225-18-091101

    550-80-225-18-091101

    PGA SOLDER TAIL

    Preci-Dip

    		 3,060
    RFQ
    		550-80-225-18-091101

    Datasheet

         		550 Bulk Active PGA 225 (18 x 18) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0420-T-2

    HLS-0420-T-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,772
    RFQ
    		HLS-0420-T-2

    Datasheet

         		HLS Bulk Active SIP 80 (4 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    40-0511-11

    40-0511-11

    CONN SOCKET SIP 40POS GOLD

    Aries Electronics

    		 2,679
    RFQ
    		40-0511-11

    Datasheet

         		511 Bulk Active SIP 40 (1 x 40) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
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