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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    517-83-365-14-000111

    517-83-365-14-000111

    CONN SOCKET PGA 365POS GOLD

    Preci-Dip

    		 3,081
    RFQ
    		517-83-365-14-000111

    Datasheet

         		517 Bulk Active PGA 365 (14 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    612-13-952-41-001000

    612-13-952-41-001000

    SOCKET CARRIER SLDRTL .900 52POS

    Mill-Max Manufacturing Corp.

    		 2,368
    RFQ
    		612-13-952-41-001000

    Datasheet

         		612 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    40-3551-11

    40-3551-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 3,596
    RFQ
    		40-3551-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    40-3554-11

    40-3554-11

    CONN IC DIP SOCKET ZIF 40POS GLD

    Aries Electronics

    		 2,874
    RFQ
    		40-3554-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    APH-1924-G-R

    APH-1924-G-R

    APH-1924-G-R

    Samtec Inc.

    		 4,586
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0524-G-R

    APH-0524-G-R

    APH-0524-G-R

    Samtec Inc.

    		 3,306
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0325-G-H

    APH-0325-G-H

    APH-0325-G-H

    Samtec Inc.

    		 3,773
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1224-G-R

    APH-1224-G-R

    APH-1224-G-R

    Samtec Inc.

    		 3,948
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0324-G-R

    APH-0324-G-R

    APH-0324-G-R

    Samtec Inc.

    		 3,418
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1324-G-R

    APH-1324-G-R

    APH-1324-G-R

    Samtec Inc.

    		 3,247
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0824-G-R

    APH-0824-G-R

    APH-0824-G-R

    Samtec Inc.

    		 3,983
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0224-G-R

    APH-0224-G-R

    APH-0224-G-R

    Samtec Inc.

    		 2,172
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    32-6571-11

    32-6571-11

    CONN IC DIP SOCKET ZIF 32POS GLD

    Aries Electronics

    		 2,914
    RFQ
    		32-6571-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    32-6573-11

    32-6573-11

    CONN IC DIP SOCKET ZIF 32POS TIN

    Aries Electronics

    		 3,051
    RFQ
    		32-6573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    110-43-316-61-801000

    110-43-316-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,517
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-316-61-801000

    110-93-316-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,427
    RFQ

    -

    		 110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    121-13-952-41-001000

    121-13-952-41-001000

    CONN IC DIP SOCKET 52POS GOLD

    Mill-Max Manufacturing Corp.

    		 2,587
    RFQ
    		121-13-952-41-001000

    Datasheet

         		121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-43-642-61-001000

    111-43-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,653
    RFQ

    -

    		 111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    111-93-642-61-001000

    111-93-642-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,502
    RFQ

    -

    		 111 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-318-G-T

    APO-318-G-T

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,554
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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