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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    APH-1522-G-H

    APH-1522-G-H

    APH-1522-G-H

    Samtec Inc.

    		 3,725
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1022-G-H

    APH-1022-G-H

    APH-1022-G-H

    Samtec Inc.

    		 3,715
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0222-G-H

    APH-0222-G-H

    APH-0222-G-H

    Samtec Inc.

    		 2,401
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0322-G-H

    APH-0322-G-H

    APH-0322-G-H

    Samtec Inc.

    		 4,863
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0422-G-H

    APH-0422-G-H

    APH-0422-G-H

    Samtec Inc.

    		 3,109
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    121-13-964-41-001000

    121-13-964-41-001000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,956
    RFQ
    		121-13-964-41-001000

    Datasheet

         		121 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-648-61-006000

    116-93-648-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,452
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0520-S-2

    HLS-0520-S-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 2,393
    RFQ
    		HLS-0520-S-2

    Datasheet

         		HLS Bulk Active SIP 100 (5 x 20) 0.100" (2.54mm) Gold - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    117-93-652-61-005000

    117-93-652-61-005000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,609
    RFQ

    -

    		 117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    546-83-225-17-003135

    546-83-225-17-003135

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    		 3,866
    RFQ
    		546-83-225-17-003135

    Datasheet

         		546 Bulk Active PGA 225 (17 x 17) 0.050" (1.27mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Press-Fit 0.100" (2.54mm) Tin - Bronze Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-13-648-61-001000

    110-13-648-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,502
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-964-61-001000

    110-43-964-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,911
    RFQ

    -

    		 110 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0320-T-18

    HLS-0320-T-18

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 4,050
    RFQ
    		HLS-0320-T-18

    Datasheet

         		HLS Tube Active SIP 60 (3 x 20) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    110-43-640-61-801000

    110-43-640-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,516
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-640-61-801000

    110-93-640-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 3,432
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    510-93-176-15-061002

    510-93-176-15-061002

    CONN PGA SOCKET 176PIN 15X15

    Mill-Max Manufacturing Corp.

    		 4,610
    RFQ

    -

    		 510 Tube Active PGA 176 (15 x 15) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-642-61-007000

    116-93-642-61-007000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,754
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    614-87-238-19-101112

    614-87-238-19-101112

    CONN SOCKET PGA 238POS GOLD

    Preci-Dip

    		 4,938
    RFQ
    		614-87-238-19-101112

    Datasheet

         		614 Bulk Active PGA 238 (19 x 19) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    517-87-565-21-111111

    517-87-565-21-111111

    CONN SOCKET PGA 565POS GOLD

    Preci-Dip

    		 2,426
    RFQ
    		517-87-565-21-111111

    Datasheet

         		517 Bulk Active PGA 565 (21 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    36-3570-11

    36-3570-11

    CONN IC DIP SOCKET ZIF 36POS GLD

    Aries Electronics

    		 4,321
    RFQ
    		36-3570-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    Total 19086 Record«Prev1... 837838839840841842843844...955Next»
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