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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-1130-G-H

    APH-1130-G-H

    APH-1130-G-H

    Samtec Inc.

    3,815
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0230-G-H

    APH-0230-G-H

    APH-0230-G-H

    Samtec Inc.

    2,119
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0830-G-H

    APH-0830-G-H

    APH-0830-G-H

    Samtec Inc.

    3,154
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0330-G-H

    APH-0330-G-H

    APH-0330-G-H

    Samtec Inc.

    4,414
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1730-G-H

    APH-1730-G-H

    APH-1730-G-H

    Samtec Inc.

    4,606
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1630-G-H

    APH-1630-G-H

    APH-1630-G-H

    Samtec Inc.

    4,787
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    111-43-950-61-001000

    111-43-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,115
    RFQ

    -

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    111-93-950-61-001000

    111-93-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    3,218
    RFQ

    -

    111 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-13-650-61-001000

    110-13-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,743
    RFQ

    -

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    550-10-169-17-101101

    550-10-169-17-101101

    PGA SOLDER TAIL

    Preci-Dip

    3,058
    RFQ
    550-10-169-17-101101

    Datasheet

    550 Bulk Active PGA 169 (17 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
    116-93-640-61-008000

    116-93-640-61-008000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,064
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    117-93-668-41-005000

    117-93-668-41-005000

    CONN IC DIP SOCKET 68POS GOLD

    Mill-Max Manufacturing Corp.

    3
    RFQ
    117-93-668-41-005000

    Datasheet

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 68 (2 x 34) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.070" (1.78mm) Solder 0.070" (1.78mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    510-41-121-13-061001

    510-41-121-13-061001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,147
    RFQ
    510-41-121-13-061001

    Datasheet

    510 Bulk Active PGA 121 (13 x 13) - - Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C - Polycyclohexylenedimethylene Terephthalate (PCT), Polyester - Brass Alloy
    115-43-952-61-001000

    115-43-952-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,544
    RFQ

    -

    115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 52 (2 x 26) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    546-83-225-17-003136

    546-83-225-17-003136

    CONN SOCKET PGA 225POS GOLD

    Preci-Dip

    4,278
    RFQ
    546-83-225-17-003136

    Datasheet

    546 Bulk Active PGA 225 (17 x 17) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame 0.050" (1.27mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Bronze
    116-43-432-61-001000

    116-43-432-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,758
    RFQ

    -

    116 Tube Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    HLS-0417-T-10

    HLS-0417-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,955
    RFQ
    HLS-0417-T-10

    Datasheet

    HLS Bulk Active SIP 68 (4 x 17) Tin - - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C - Thermoplastic - -
    116-93-648-61-003000

    116-93-648-61-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    2,501
    RFQ

    -

    116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-93-964-41-003000

    126-93-964-41-003000

    CONN IC DIP SOCKET 64POS GOLD

    Mill-Max Manufacturing Corp.

    4,640
    RFQ
    126-93-964-41-003000

    Datasheet

    126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    126-43-964-41-003000

    126-43-964-41-003000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    4,698
    RFQ
    126-43-964-41-003000

    Datasheet

    126 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Wire Wrap 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
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