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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    36-3575-11

    36-3575-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 3,323
    RFQ
    		36-3575-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6573-11

    36-6573-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 4,652
    RFQ
    		36-6573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    36-6574-11

    36-6574-11

    CONN IC DIP SOCKET ZIF 36POS TIN

    Aries Electronics

    		 2,291
    RFQ
    		36-6574-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6552-11

    44-6552-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 4,503
    RFQ
    		44-6552-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    44-6553-11

    44-6553-11

    CONN IC DIP SOCKET ZIF 44POS GLD

    Aries Electronics

    		 4,641
    RFQ
    		44-6553-11

    Datasheet

         		55 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 44 (2 x 22) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold - Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled -
    550-10-192M16-001152

    550-10-192M16-001152

    BGA SOLDER TAIL

    Preci-Dip

    		 4,692
    RFQ
    		550-10-192M16-001152

    Datasheet

         		550 Bulk Active BGA 192 (16 x 16) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    115-43-950-61-001000

    115-43-950-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,540
    RFQ

    -

    		 115 Tube Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    441-PPG21001-10

    441-PPG21001-10

    CONN SOCKET PGA ZIF GOLD

    Aries Electronics

    		 3,621
    RFQ
    		441-PPG21001-10

    Datasheet

         		- Bulk Active PGA, ZIF (ZIP) - 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS) -65°C ~ 125°C
    116-43-650-61-001000

    116-43-650-61-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,485
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    322-13-164-41-001000

    322-13-164-41-001000

    SOCKET 2 LEVEL WRAPOST SIP 64POS

    Mill-Max Manufacturing Corp.

    		 2,565
    RFQ
    		322-13-164-41-001000

    Datasheet

         		322 Tube Active SIP 64 (1 x 64) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    HLS-0512-G-2

    HLS-0512-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,369
    RFQ
    		HLS-0512-G-2

    Datasheet

         		HLS Bulk Active SIP 60 (5 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-13-624-61-801000

    110-13-624-61-801000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 4,152
    RFQ

    -

    		 110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame, Decoupling Capacitor Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-93-650-61-006000

    116-93-650-61-006000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,649
    RFQ

    -

    		 116 Tube Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    714-43-258-31-018000

    714-43-258-31-018000

    CONN IC DIP SOCKET 58POS GOLD

    Mill-Max Manufacturing Corp.

    		 4,793
    RFQ
    		714-43-258-31-018000

    Datasheet

         		714 Bulk Active DIP, 0.1" (2.54mm) Row Spacing 58 (2 x 29) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Carrier, Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    122-11-964-41-001000

    122-11-964-41-001000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 2,014
    RFQ
    		122-11-964-41-001000

    Datasheet

         		122 Tube Active DIP, 0.9" (22.86mm) Row Spacing 64 (2 x 32) 0.100" (2.54mm) - - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) - - Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-628-G-R

    APO-628-G-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    		 2,694
    RFQ
    		APO-628-G-R

    Datasheet

         		APO Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    517-83-411-20-111111

    517-83-411-20-111111

    CONN SOCKET PGA 411POS GOLD

    Preci-Dip

    		 2,429
    RFQ
    		517-83-411-20-111111

    Datasheet

         		517 Bulk Active PGA 411 (20 x 20) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    APH-0430-G-H

    APH-0430-G-H

    APH-0430-G-H

    Samtec Inc.

    		 2,065
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1030-G-H

    APH-1030-G-H

    APH-1030-G-H

    Samtec Inc.

    		 4,036
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0630-G-H

    APH-0630-G-H

    APH-0630-G-H

    Samtec Inc.

    		 2,984
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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