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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    APH-1438-G-H

    APH-1438-G-H

    APH-1438-G-H

    Samtec Inc.

    		 4,021
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0538-G-H

    APH-0538-G-H

    APH-0538-G-H

    Samtec Inc.

    		 2,361
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1938-G-H

    APH-1938-G-H

    APH-1938-G-H

    Samtec Inc.

    		 3,744
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1538-G-H

    APH-1538-G-H

    APH-1538-G-H

    Samtec Inc.

    		 3,636
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0838-G-H

    APH-0838-G-H

    APH-0838-G-H

    Samtec Inc.

    		 4,950
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1638-G-H

    APH-1638-G-H

    APH-1638-G-H

    Samtec Inc.

    		 2,837
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1238-G-H

    APH-1238-G-H

    APH-1238-G-H

    Samtec Inc.

    		 3,340
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0738-G-H

    APH-0738-G-H

    APH-0738-G-H

    Samtec Inc.

    		 3,190
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0238-G-H

    APH-0238-G-H

    APH-0238-G-H

    Samtec Inc.

    		 3,928
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0338-G-H

    APH-0338-G-H

    APH-0338-G-H

    Samtec Inc.

    		 2,067
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0638-G-H

    APH-0638-G-H

    APH-0638-G-H

    Samtec Inc.

    		 2,556
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    42-6570-11

    42-6570-11

    CONN IC DIP SOCKET ZIF 42POS GLD

    Aries Electronics

    		 4,578
    RFQ
    		42-6570-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Beryllium Copper
    42-6573-11

    42-6573-11

    CONN IC DIP SOCKET ZIF 42POS TIN

    Aries Electronics

    		 4,219
    RFQ
    		42-6573-11

    Datasheet

         		57 Bulk Active DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing 42 (2 x 21) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyphenylene Sulfide (PPS), Glass Filled 200.0µin (5.08µm) Beryllium Copper
    514-83-256M16-000148

    514-83-256M16-000148

    CONN SOCKET BGA 256POS GOLD

    Preci-Dip

    		 2,361
    RFQ
    		514-83-256M16-000148

    Datasheet

         		514 Bulk Active BGA 256 (16 x 16) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    514-83-256M20-001148

    514-83-256M20-001148

    CONN SOCKET BGA 256POS GOLD

    Preci-Dip

    		 3,150
    RFQ
    		514-83-256M20-001148

    Datasheet

         		514 Bulk Active BGA 256 (20 x 20) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    614-87-299-20-001112

    614-87-299-20-001112

    CONN SOCKET PGA 299POS GOLD

    Preci-Dip

    		 3,668
    RFQ
    		614-87-299-20-001112

    Datasheet

         		614 Bulk Active PGA 299 (20 x 20) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    510-91-209-17-081003

    510-91-209-17-081003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 3,887
    RFQ
    		510-91-209-17-081003

    Datasheet

         		510 Bulk Active PGA 209 (17 x 17) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    120-PGM13015-40

    120-PGM13015-40

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 3,432
    RFQ
    		120-PGM13015-40

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    614-83-238-19-101112

    614-83-238-19-101112

    CONN SOCKET PGA 238POS GOLD

    Preci-Dip

    		 3,501
    RFQ
    		614-83-238-19-101112

    Datasheet

         		614 Bulk Active PGA 238 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    133-PGM14014-40

    133-PGM14014-40

    CONN SOCKET PGA GOLD

    Aries Electronics

    		 2,208
    RFQ
    		133-PGM14014-40

    Datasheet

         		PGM Bulk Active PGA - Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    Total 19086 Record«Prev1... 861862863864865866867868...955Next»
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