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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
APH-0632-G-TAPH-0632-G-T |
3,301 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1332-G-TAPH-1332-G-T |
4,163 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0732-G-TAPH-0732-G-T |
2,907 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1132-G-TAPH-1132-G-T |
3,049 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
116-43-950-61-001000CONN IC SKT DBL |
4,525 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
116-93-950-61-001000CONN IC SKT DBL |
2,473 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 50 (2 x 25) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
32-6554-16CONN IC DIP SOCKET ZIF 32POS |
2,795 |
|
Datasheet |
55 | Bulk | Active | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Nickel Boron | Polyphenylene Sulfide (PPS), Glass Filled | 50.0µin (1.27µm) | Beryllium Copper |
|
|
APH-0430-G-RAPH-0430-G-R |
4,557 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1830-G-RAPH-1830-G-R |
3,396 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1530-G-RAPH-1530-G-R |
4,311 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1930-G-RAPH-1930-G-R |
3,366 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-0630-G-RAPH-0630-G-R |
4,897 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1230-G-RAPH-1230-G-R |
3,386 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
APH-1330-G-RAPH-1330-G-R |
3,240 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
550-10-356M26-001166BGA PIN ADAPTER 1.27MM SMD |
4,041 |
|
Datasheet |
550 | Bulk | Active | BGA | 356 (26 x 26) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Gold | FR4 Epoxy Glass | 10.0µin (0.25µm) | Brass |
|
|
116-43-952-61-001000CONN IC SKT DBL |
2,483 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
116-93-952-61-001000CONN IC SKT DBL |
4,298 |
|
- |
116 | Tube | Active | DIP, 0.9" (22.86mm) Row Spacing | 52 (2 x 26) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
517-83-528-21-121111CONN SOCKET PGA 528POS GOLD |
3,036 |
|
Datasheet |
517 | Bulk | Active | PGA | 528 (21 x 21) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
44-3571-11CONN IC DIP SOCKET ZIF 44POS GLD |
3,286 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Polyphenylene Sulfide (PPS), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
|
44-3575-11CONN IC DIP SOCKET ZIF 44POS TIN |
2,324 |
|
Datasheet |
57 | Bulk | Active | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing | 44 (2 x 22) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Beryllium Copper |
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