Login or REGISTER
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    510-13-100-10-000001

    510-13-100-10-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    2,763
    RFQ
    510-13-100-10-000001

    Datasheet

    510 Bulk Active PGA 100 (10 x 10) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    550-10-357M19-001166

    550-10-357M19-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    4,845
    RFQ
    550-10-357M19-001166

    Datasheet

    550 Bulk Active BGA 357 (19 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    APH-1338-G-R

    APH-1338-G-R

    APH-1338-G-R

    Samtec Inc.

    4,933
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1838-G-R

    APH-1838-G-R

    APH-1838-G-R

    Samtec Inc.

    2,127
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0938-G-R

    APH-0938-G-R

    APH-0938-G-R

    Samtec Inc.

    2,841
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1038-G-R

    APH-1038-G-R

    APH-1038-G-R

    Samtec Inc.

    2,825
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1938-G-R

    APH-1938-G-R

    APH-1938-G-R

    Samtec Inc.

    3,602
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0238-G-R

    APH-0238-G-R

    APH-0238-G-R

    Samtec Inc.

    4,532
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0838-G-R

    APH-0838-G-R

    APH-0838-G-R

    Samtec Inc.

    3,853
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0738-G-R

    APH-0738-G-R

    APH-0738-G-R

    Samtec Inc.

    3,670
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-0438-G-R

    APH-0438-G-R

    APH-0438-G-R

    Samtec Inc.

    4,792
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    APH-1738-G-R

    APH-1738-G-R

    APH-1738-G-R

    Samtec Inc.

    4,947
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    514-83-419-19-001154

    514-83-419-19-001154

    CONN SOCKET PGA 419POS GOLD

    Preci-Dip

    2,356
    RFQ
    514-83-419-19-001154

    Datasheet

    514 Bulk Active PGA 419 (19 x 19) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled - Brass
    HLS-1008-G-2

    HLS-1008-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,945
    RFQ
    HLS-1008-G-2

    Datasheet

    HLS Bulk Active SIP 80 (10 x 8) Gold 30.0µin (0.76µm) - Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 140°C Gold Thermoplastic 10.0µin (0.25µm) -
    510-13-101-13-061001

    510-13-101-13-061001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,657
    RFQ
    510-13-101-13-061001

    Datasheet

    510 Bulk Active PGA 101 (13 x 13) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    550-10-241-18-071101

    550-10-241-18-071101

    PGA SOLDER TAIL

    Preci-Dip

    3,445
    RFQ
    550-10-241-18-071101

    Datasheet

    550 Bulk Active PGA 241 (18 x 18) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled 10.0µin (0.25µm) Brass
    510-91-225-15-000003

    510-91-225-15-000003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    4,258
    RFQ
    510-91-225-15-000003

    Datasheet

    510 Bulk Active PGA 225 (15 x 15) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    550-10-360M19-001166

    550-10-360M19-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    2,954
    RFQ
    550-10-360M19-001166

    Datasheet

    550 Bulk Active BGA 360 (19 x 19) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) -55°C ~ 125°C Gold FR4 Epoxy Glass 10.0µin (0.25µm) Brass
    24-6556-41

    24-6556-41

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,998
    RFQ
    24-6556-41

    Datasheet

    6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder Cup 0.100" (2.54mm) - Gold Polyphenylene Sulfide (PPS), Glass Filled 10.0µin (0.25µm) Brass
    APH-0840-G-H

    APH-0840-G-H

    APH-0840-G-H

    Samtec Inc.

    4,129
    RFQ

    -

    * - Active - - - - - - - - - - - - - - -
    Total 19086 Record«Prev1... 864865866867868869870871...955Next»
    Your email
    Your message
    KATY Electronic Technology Co., LTD

    HOME

    KATY Electronic Technology Co., LTD

    PRODUCT

    KATY Electronic Technology Co., LTD

    PHONE

    KATY Electronic Technology Co., LTD

    USER