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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    510-13-100-10-000001

    510-13-100-10-000001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 2,763
    RFQ
    		510-13-100-10-000001

    Datasheet

         		510 Bulk Active PGA 100 (10 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-357M19-001166

    550-10-357M19-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    		 4,845
    RFQ
    		550-10-357M19-001166

    Datasheet

         		550 Bulk Active BGA 357 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    APH-1338-G-R

    APH-1338-G-R

    APH-1338-G-R

    Samtec Inc.

    		 4,933
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1838-G-R

    APH-1838-G-R

    APH-1838-G-R

    Samtec Inc.

    		 2,127
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0938-G-R

    APH-0938-G-R

    APH-0938-G-R

    Samtec Inc.

    		 2,841
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1038-G-R

    APH-1038-G-R

    APH-1038-G-R

    Samtec Inc.

    		 2,825
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1938-G-R

    APH-1938-G-R

    APH-1938-G-R

    Samtec Inc.

    		 3,602
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0238-G-R

    APH-0238-G-R

    APH-0238-G-R

    Samtec Inc.

    		 4,532
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0838-G-R

    APH-0838-G-R

    APH-0838-G-R

    Samtec Inc.

    		 3,853
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0738-G-R

    APH-0738-G-R

    APH-0738-G-R

    Samtec Inc.

    		 3,670
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-0438-G-R

    APH-0438-G-R

    APH-0438-G-R

    Samtec Inc.

    		 4,792
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    APH-1738-G-R

    APH-1738-G-R

    APH-1738-G-R

    Samtec Inc.

    		 4,947
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
    514-83-419-19-001154

    514-83-419-19-001154

    CONN SOCKET PGA 419POS GOLD

    Preci-Dip

    		 2,356
    RFQ
    		514-83-419-19-001154

    Datasheet

         		514 Bulk Active PGA 419 (19 x 19) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-1008-G-2

    HLS-1008-G-2

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    		 3,945
    RFQ
    		HLS-1008-G-2

    Datasheet

         		HLS Bulk Active SIP 80 (10 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    510-13-101-13-061001

    510-13-101-13-061001

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,657
    RFQ
    		510-13-101-13-061001

    Datasheet

         		510 Bulk Active PGA 101 (13 x 13) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-241-18-071101

    550-10-241-18-071101

    PGA SOLDER TAIL

    Preci-Dip

    		 3,445
    RFQ
    		550-10-241-18-071101

    Datasheet

         		550 Bulk Active PGA 241 (18 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    510-91-225-15-000003

    510-91-225-15-000003

    SKT PGA SOLDRTL

    Mill-Max Manufacturing Corp.

    		 4,258
    RFQ
    		510-91-225-15-000003

    Datasheet

         		510 Bulk Active PGA 225 (15 x 15) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    550-10-360M19-001166

    550-10-360M19-001166

    BGA PIN ADAPTER 1.27MM SMD

    Preci-Dip

    		 2,954
    RFQ
    		550-10-360M19-001166

    Datasheet

         		550 Bulk Active BGA 360 (19 x 19) 0.050" (1.27mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.050" (1.27mm) Gold 10.0µin (0.25µm) Brass FR4 Epoxy Glass -55°C ~ 125°C
    24-6556-41

    24-6556-41

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    		 2,998
    RFQ
    		24-6556-41

    Datasheet

         		6556 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled -
    APH-0840-G-H

    APH-0840-G-H

    APH-0840-G-H

    Samtec Inc.

    		 4,129
    RFQ

    -

    		 * - Active - - - - - - - - - - - - - - -
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