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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    34-6511-10

    34-6511-10

    CONN IC DIP SOCKET 34POS TIN

    Aries Electronics

    		 4,192
    RFQ
    		34-6511-10

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    34-6511-11

    34-6511-11

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    		 3,493
    RFQ
    		34-6511-11

    Datasheet

         		511 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    02-0501-30

    02-0501-30

    CONN SOCKET SIP 2POS TIN

    Aries Electronics

    		 2,892
    RFQ
    		02-0501-30

    Datasheet

         		501 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    03-0501-21

    03-0501-21

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    		 4,982
    RFQ
    		03-0501-21

    Datasheet

         		501 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    07-7XXXX-10

    07-7XXXX-10

    CONN SOCKET SIP 7POS TIN

    Aries Electronics

    		 2,228
    RFQ
    		07-7XXXX-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-7XXXX-10

    12-7XXXX-10

    CONN SOCKET SIP 12POS TIN

    Aries Electronics

    		 3,200
    RFQ
    		12-7XXXX-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-7XXXX-10

    20-7XXXX-10

    CONN SOCKET SIP 20POS TIN

    Aries Electronics

    		 4,316
    RFQ
    		20-7XXXX-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-7XXXX-10

    25-7XXXX-10

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    		 3,977
    RFQ
    		25-7XXXX-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    33-7XXXX-10

    33-7XXXX-10

    CONN SOCKET SIP 33POS TIN

    Aries Electronics

    		 4,937
    RFQ
    		33-7XXXX-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 33 (1 x 33) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    35-7XXXX-10

    35-7XXXX-10

    CONN SOCKET SIP 35POS TIN

    Aries Electronics

    		 4,753
    RFQ
    		35-7XXXX-10

    Datasheet

         		700 Elevator Strip-Line™ Bulk Active SIP 35 (1 x 35) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    1109011

    1109011

    SERIES 513 LO-PRO W/SOLDER TAIL

    Aries Electronics

    		 3,956
    RFQ
    		1109011

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    4236-118-14

    4236-118-14

    518 OPN FRM COLLET SCKT SLDR TAI

    Aries Electronics

    		 3,519
    RFQ
    		4236-118-14

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    2357-108-12

    2357-108-12

    EJECT-A-DP LCK/EJCT SCKT SLDR TL

    Aries Electronics

    		 3,727
    RFQ
    		2357-108-12

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    34-6823-90

    34-6823-90

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    		 3,077
    RFQ
    		34-6823-90

    Datasheet

         		Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
    1109785

    1109785

    800 VERTISOCKET HORIZONTAL MOUNT

    Aries Electronics

    		 2,207
    RFQ
    		1109785

    Datasheet

         		- - Active - - - - - - - - - - - - - - -
    14-8470-10

    14-8470-10

    CONN IC DIP SOCKET 14POS TIN

    Aries Electronics

    		 2,806
    RFQ
    		14-8470-10

    Datasheet

         		8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-28440-10

    10-28440-10

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    		 2,409
    RFQ
    		10-28440-10

    Datasheet

         		8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    18-68500-10

    18-68500-10

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    		 4,627
    RFQ
    		18-68500-10

    Datasheet

         		8 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-8620-210C

    08-8620-210C

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    		 4,904
    RFQ
    		08-8620-210C

    Datasheet

         		8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-8300-210C

    10-8300-210C

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    		 2,638
    RFQ
    		10-8300-210C

    Datasheet

         		8 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
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