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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
54020-84030LFCONN SOCKET PLCC 84POS TIN |
3,613 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | Tin | 100.0µin (2.54µm) | Copper Alloy | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | Polyphenylene Sulfide (PPS) | 100.0µin (2.54µm) | Copper Alloy |
|
|
2040636-1CONN SOCKET LGA 1567POS GOLD |
4,831 |
|
Datasheet |
- | Tray | Obsolete | LGA | 1567 | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | 0.040" (1.02mm) | Solder | 0.039" (1.00mm) | - | - | Thermoplastic | - | Copper Alloy |
|
|
2-210715-1CONN SOCKET PGA 241POS GOLD |
2,316 |
|
Datasheet |
PKA | Bulk | Active | PGA | 241 (18 x 18) | Gold | 10.0µin (0.25µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | - | Tin-Lead | Thermoplastic, Polyester, Glass Filled | 118.1µin (3.00µm) | Phosphor Bronze |
|
|
210715-4CONN SOCKET PGA 241POS GOLD |
4,090 |
|
Datasheet |
PKA | Bulk | Active | PGA | 241 (18 x 18) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | - | Tin-Lead | Thermoplastic, Polyester, Glass Filled | 118.1µin (3.00µm) | Phosphor Bronze |
|
|
210796-4CONN SOCKET PGA 144POS GOLD |
2,500 |
|
Datasheet |
FCM | Tube | Active | PGA | 144 (15 x 15) | Gold | 30.0µin (0.76µm) | - | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin-Lead | - | 196.9µin (5.00µm) | - |
|
|
210218-4CONN SOCKET PGA 181POS GOLD |
4,230 |
|
Datasheet |
- | Tube | Active | PGA | 181 (15 x 15) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | - | Tin-Lead | Thermoplastic, Polyester, Glass Filled | 118.1µin (3.00µm) | Phosphor Bronze |
|
|
2287402-1CONN SOCKET LGA 1151POS GOLD |
2,648 |
|
Datasheet |
- | Bulk | Obsolete | LGA | 1151 | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Closed Frame | 0.036" (0.91mm) | Solder | 0.036" (0.91mm) | - | Gold | Thermoplastic | 15.0µin (0.38µm) | Copper Alloy |
|
|
1825575-2CONN IC DIP SOCKET 8POS TIN |
4,554 |
|
Datasheet |
- | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | 196.9µin (5.00µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Thermoplastic, Polyester | 196.9µin (5.00µm) | Brass |
|
|
508-AG11D-ESLCONN IC DIP SOCKET 8POS GOLD |
3,824 |
|
Datasheet |
500 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | - | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
5-1437532-0CONN IC DIP SOCKET 28POS GOLD |
3,457 |
|
Datasheet |
500 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | - | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester | - | Copper Alloy |
|
|
516-AG12D-ESCONN IC DIP SOCKET 16POS TINLEAD |
3,813 |
|
Datasheet |
500 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin-Lead | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Beryllium Copper |
|
|
524-AG12DCONN IC DIP SOCKET 24POS TINLEAD |
3,694 |
|
Datasheet |
500 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Tin-Lead | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Brass, Copper |
|
|
608-CG1TCONN IC DIP SOCKET 8POS GOLD |
2,031 |
|
Datasheet |
600 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | - | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Thermoplastic, Polyester | - | Phosphor Bronze |
|
|
6437540-7CONN IC DIP SOCKET 7POS GOLD |
3,077 |
|
Datasheet |
800 | Bulk | Active | DIP, 0.75" (19.05mm) Row Spacing | 7 (1 x 7) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | 80.0µin (2.03µm) | Copper Alloy |
|
|
8059-2G10CONN SOCKET TRANSIST TO-5 10POS |
4,290 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-5 | 10 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin-Lead | Polyamide (PA), Nylon | - | Brass |
|
|
8059-2G3CONN SOCKET TRANSIST TO-5 4POS |
4,218 |
|
- |
8059 | Bulk | Obsolete | Transistor, TO-5 | 4 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polyamide (PA), Nylon, Glass Filled | - | Brass |
|
|
8059-2G6CONN SOCKET TRANSIST TO-5 8POS |
3,219 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Copper Alloy | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polyamide (PA), Nylon | - | Copper Alloy |
|
|
8059-2G7CONN SOCKET TRANSIST TO-5 8POS |
4,445 |
|
- |
- | Bulk | Obsolete | Transistor, TO-5 | 8 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polyamide (PA), Nylon, Glass Filled | - | Brass |
|
|
8080-1G10CONN SOCKET TRANSIST TO-3 3POS |
4,563 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Diallyl Phthalate (DAP) | - | Beryllium Copper |
|
|
8080-1G16CONN SOCKET TRANSIST TO-3 3POS |
4,480 |
|
Datasheet |
8080 | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Silver | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Silver | Diallyl Phthalate (DAP) | - | Beryllium Copper |
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