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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
8080-1G2CONN SOCKET TRANSIST TO-3 3POS |
3,713 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Silver | 500.0µin (12.70µm) | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Silver | Diallyl Phthalate (DAP) | - | Beryllium Copper |
|
|
8080-1G3CONN SOCKET TRANSIST TO-3 3POS |
3,123 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin-Lead | Phenolic | - | Beryllium Copper |
|
|
8080-1G35CONN SOCKET TRANSIST TO-3 3POS |
2,477 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Tin-Lead | 200.0µin (5.08µm) | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin-Lead | Diallyl Phthalate (DAP) | 20.0µin (0.51µm) | Beryllium Copper |
|
|
8080-1G36CONN SOCKET TRANSIST TO-3 3POS |
4,019 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Silver | 500.0µin (12.70µm) | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Silver | Phenolic | 500.0µin (12.70µm) | Beryllium Copper |
|
|
8080-1G37CONN SOCKET TRANSIST TO-3 3POS |
4,661 |
|
Datasheet |
- | Bulk | Obsolete | Transistor, TO-3 | 3 (Oval) | Silver | 500.0µin (12.70µm) | Beryllium Copper | Chassis Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Silver | Diallyl Phthalate (DAP) | 500.0µin (12.70µm) | Beryllium Copper |
|
|
8-1437504-6CONN SOCKET TRANSIST TO-3 3POS |
3,248 |
|
Datasheet |
8080 | Bulk | Active | Transistor, TO-3 | 3 (Oval) | Gold | 50.0µin (1.27µm) | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Diallyl Phthalate (DAP) | - | Beryllium Copper |
|
|
824-AG66DCONN IC DIP SOCKET 24POS GOLD |
3,257 |
|
Datasheet |
800 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 24 (2 x 12) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | 80.0µin (2.03µm) | Copper Alloy |
|
|
9-1437537-3CONN IC DIP SOCKET 3POS GOLD |
4,543 |
|
Datasheet |
800 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 3 (1 x 3) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | 80.0µin (2.03µm) | Copper Alloy |
|
|
9-1437539-6CONN IC DIP SOCKET 6POS GOLD |
4,941 |
|
Datasheet |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 6 (2 x 3) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | 80.0µin (2.03µm) | Copper Alloy |
|
|
2040636-5CONN SOCKET LGA 1567POS GOLD |
3,076 |
|
Datasheet |
- | Tray | Active | LGA | 1567 | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | 0.040" (1.02mm) | Solder | 0.039" (1.00mm) | - | - | Thermoplastic | - | Copper Alloy |
|
|
1977291-1CONN IC DIP SOCKET 20POS GOLD |
4,559 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | - | Thermoplastic, Polyester | - | Brass |
|
|
8-1437529-1CONN IC DIP SOCKET 8POS GOLD |
2,566 |
|
Datasheet |
500 | Bulk | Active | DIP, 0.4" (10.16mm) Row Spacing | 8 (2 x 4) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Thermoplastic, Polyester | 47.2µin (1.20µm) | Copper Alloy |
|
|
1825088-2CONN IC DIP SOCKET 12POS GOLD |
3,152 |
|
Datasheet |
- | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | - | - | Thermoplastic, Polyester | - | Brass |
|
|
8-1437531-4520-AG11F=SOCKET ASSY |
3,065 |
|
Datasheet |
500 | Bulk | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
|
1747890-1DSL ASSY LGA771 LEADED |
3,869 |
|
Datasheet |
- | Tray | Active | LGA | 771 (33 x 33) | - | - | Copper Alloy | Surface Mount | - | 0.043" (1.09mm) | Solder | 0.043" (1.09mm) | -25°C ~ 100°C | Tin | Thermoplastic | - | - |
|
|
1-1981837-2CONN SOCKET LGA 1366POS GOLD |
2,147 |
|
Datasheet |
- | Tray | Active | LGA | 1366 (32 x 41) | Gold | 30.0µin (0.76µm) | Copper Alloy | Surface Mount | Open Frame | 0.040" (1.02mm) | Solder | 0.040" (1.01mm) | - | - | Thermoplastic | - | - |
|
|
1825532-4CONN SOCKET SIP 10POS GOLD |
3,131 |
|
Datasheet |
- | - | Obsolete | SIP | 10 (1 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyester | Flash | Beryllium Copper |
|
|
4-2013620-3CONN SOCKET PGA ZIF 989POS GOLD |
4,216 |
|
Datasheet |
- | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.039" (1.00mm) | - | Tin-Lead | Thermoplastic | 15.0µin (0.38µm) | Copper Alloy |
|
|
1-2013620-1CONN SOCKET PGA ZIF 989POS GOLD |
3,683 |
|
Datasheet |
- | Tape & Reel (TR) | Active | PGA, ZIF (ZIP) | 989 (35 x 36) | Gold | 15.0µin (0.38µm) | Copper Alloy | Surface Mount | Open Frame | 0.039" (1.00mm) | Solder | 0.039" (1.00mm) | - | Tin-Lead | Thermoplastic | 15.0µin (0.38µm) | Copper Alloy |
|
|
9-6437529-4CONN IC DIP SOCKET 8POS GOLD |
3,767 |
|
Datasheet |
- | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 8 (2 x 4) | Gold | - | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Thermoplastic, Polyester | - | Brass |
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