AI data centers are driving a surge in power management demands.

Artificial intelligence is rapidly transforming the global electronics industry. With the increasing demand for large model training, generative AI, and high-performance computing, the energy consumption of AI data centers is showing a trend of rapid increase. This not only drives the development of the GPU and server markets, but also gives the entire power management industry a new round of growth opportunities.
Currently, power conversion efficiency, advanced cooling technologies, and intelligent energy management have become the core key elements of AI infrastructure construction.

The power consumption of AI servers continues to rise.

Traditional servers generally have a power consumption of only a few hundred watts. Due to the increasing size of AI model parameters, the continuous growth of GPU computing power demand, the rapid increase in data throughput, and the increased overall load of high-speed storage and network systems, these factors can lead to a single cabinet of AI servers equipped with high-performance GPUs having a power consumption of several thousand watts, and some high-density AI clusters even higher.
The AI training and inference processes require continuous and large-scale high-performance computing, causing the power consumption of data centers to rise rapidly. Therefore, how to improve power supply efficiency and reduce energy loss will become one of the most concerned issues for major cloud service providers and data center operators.

The demand for power management chips is growing rapidly

The demand for a large number of power-related electronic components is increasing:
Power Management ICs (PMICs)
PMICs are responsible for voltage regulation and power distribution within servers, and are crucial components for ensuring the stable operation of GPUs. High-efficiency and high-precision PMICs can meet the high power supply stability requirements of AI chips.
MOSFETs and IGBTs
Power semiconductors are widely used in: server power supplies, voltage conversion, UPS systems, and power modules. The market demand for high-performance MOSFETs and IGBTs is increasing as the power of AI servers continues to rise.
SiC and GaN power devices
SiC and GaN are important directions for the next-generation high-efficiency power devices.
Advantages include:

• Lower energy consumption
• Higher switching efficiency
• Higher temperature resistance
• Smaller size
• Higher power density

These characteristics are highly suitable for high-power and high-density application scenarios in AI data centers.

Heat dissipation and liquid cooling have become new hotspots.

Heat dissipation and liquid cooling have become hot topics. As GPU power consumption continues to increase, traditional air cooling solutions are approaching their limits. The heat dissipation issue has become one of the key challenges in AI server design. Currently, more and more data centers are deploying:

• Liquid cooling servers
• Cold plate cooling
• Immersion cooling
• High thermal conductivity materials
• High-performance fan systems

In the future, liquid cooling technology is expected to become the mainstream direction for large-scale AI data centers.

Core industry indicators

In the past, the semiconductor industry placed more emphasis on the absolute computing power performance of chips.
Nowadays, the industry competition logic has changed, and performance per watt has become the core metric in the industry.
The focus of industry competition is shifting to:

• Performance per Watt (per watt performance)
• Energy efficiency
• Thermal management capability
• Overall system power consumption optimization

For AI computing power data centers, the improvement in energy efficiency can significantly reduce daily operating expenses and directly determine the expansion space and long-term operational stability of the cluster.
Therefore, high-efficiency power supply architectures have become the mainstream development trend in the entire semiconductor and AI industry.

AI is driving the upgrade of the entire electronic industry chain.

The AI wave continues to heat up, not only driving the vigorous growth of the GPU sector, but also comprehensively driving the simultaneous upgrade of the entire upstream and downstream of the electronic industry chain.
Several sub-sectors have witnessed significant growth opportunities, covering:
Power modules, power semiconductors, high-frequency connectors, PCB boards, passive components, heat dissipation materials, and inductors and capacitors, etc.
Among them, high-reliability, high-frequency, and high-power density high-end electronic components have a rapidly rising market demand.

About popular power management chips and device models for AI data centers

In an environment where the power consumption of AI servers is constantly increasing, major semiconductor manufacturers have launched new power solutions specifically for AI data centers. Among the models that have received high attention are:
1. Texas Instruments' 800V power solution for AI data centers
Texas Instruments has introduced an 800V DC power architecture for the next-generation AI data centers and has collaborated with NVIDIA to develop power supply solutions for AI servers.
Key solutions include: 

• 800V Hot-Swap Controller
• 800V to 6V DC/DC Bus Converter
• 6V to <1V Multiphase Buck Converter
• 30kW AI Server PSU

The efficiency of its GaN power solution can reach 97.6%.
2. Infineon TDM24745T AI server power module TDM24745T
Become one of the popular power modules for AI servers in 2026.
Features include: 

• Quad-Phase Power Module
• The peak current can reach up to 320A.
• It supports the TLVR architecture.
• It is designed to power the AI GPU core.
• It adopts the OptiMOS technology.

This model is mainly used for: 

• AI GPU
• High-performance computing (HPC)
• AI acceleration card
• High-density server

3. Infineon XDPE1E digital multi-phase PWM controller
XDPE1E series
Mainly used for:

• GPU core power supply
• High current DC-DC conversion

AI server motherboard VRM Feature:

• Support PMBus
• Digital telemetry function
• Multi-phase Buck control
• High transient response
• Suitable for the new generation of AI acceleration platforms.

4. Vicor high-density power module
Popular product directions include: 

• BCM Bus Converter
• PRM Regulator
• VTM Current Multiplier

Main features:

• High power density
• Miniaturization
• High conversion efficiency
• AI GPU power supply optimization

Currently widely used in:

• AI servers
• GPU power supply architecture
• HPC platforms

5.GaN and SiC hot device directions
Currently, AI servers are being extensively adopted: 

• GaN FET
• SiC MOSFET
• High-voltage DC/DC module

With the impetus of AI, power semiconductors have become one of the fastest-growing directions in the current semiconductor market. 

Summary

AI not only restructured the software architecture and computing paradigm, but also profoundly reshaped the entire power electronics industry landscape.
In the coming years, with the accelerated expansion of global AI data centers, efficient power management, high-end power devices, and liquid cooling cooling technologies will become the core mainstream development tracks in the electronics industry.
For electronic component manufacturers, the AI infrastructure track is undoubtedly a core opportunity with significant growth potential and expansion space in the future.