Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
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MC35FS4505NAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS6506NAESYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MFS8633BMDA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC33FS6517KAER2SYSTEM BASIS CHIP, DCDC 1.5A VCO NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4507CAER2SYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC32PF1550A3EPR2POWER MANAGEMENT IC: 3 BUCK REGS NXP USA Inc. |
0 |
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![]() Datasheet |
- | 40-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Embedded Systems, Low-Power IoT, Mobile/Wearable Devices | - | 3.8V ~ 7V | -40°C ~ 85°C | - | - | Surface Mount | 40-HVQFN (5x5) |
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MPF7100BMMA0ESR2POWER MANAGEMENT IC, I.MX 8, I.M NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF7100BVBA0ESR2POWER MANAGEMENT IC, I.MX 8, I.M NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF7100BVBA4ESR2POWER MANAGEMENT IC, I.MX 8DX/8D NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MPF7100BVBA2ESR2POWER MANAGEMENT IC, I.MX 8XL WI NXP USA Inc. |
0 |
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![]() Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | 2.5V ~ 5.5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |