| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MPF7100BVBA3ESR2POWER MANAGEMENT IC, I.MX 8DX/DX NXP USA Inc. |
4,348 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 2.5V ~ 5.5V |
|
MPF7100BVBA1ESR2POWER MANAGEMENT IC, I.MX 8XL WI NXP USA Inc. |
3,416 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | 10µA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 2.5V ~ 5.5V |
|
MFS8610BMDA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
2,040 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 60V |
|
MC33FS4502NAESYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
3,952 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MFS8602BMDA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
4,276 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 60V |
|
MC35FS6505CAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
4,588 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MFS8406AMBP4ESR2SAFETY POWER MANAGEMENT IC, QFN4 NXP USA Inc. |
4,853 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | 15mA | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) | 60V |
|
MC33FS4507NAESYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
4,133 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6501CAER2SYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
4,104 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS6527NAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
3,121 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |