Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Product Status | Applications | Current - Supply | Voltage - Supply | Operating Temperature | Grade | Qualification | Mounting Type | Supplier Device Package |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MFS8611BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
0 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
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MFS2632AMDA0ADR2AUTO SBC NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | 30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MFS2613AMDH3ADR2MFS2613AMDH3ADR2 NXP USA Inc. |
0 |
|
- |
- | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
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MC35FS4506NAER2SYSTEM BASIS CHIP, LINEAR 0.5A V NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MPF5200AMBA4ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 32-PowerWFQFN | Tray | Active | - | 40µA | 2.7V ~ 5.5V | -40°C ~ 125°C | Automotive | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |
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MPF5200AMBA2ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 32-PowerWFQFN | Tray | Active | - | 40µA | 2.7V ~ 5.5V | -40°C ~ 125°C | Automotive | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |
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MPF5200AMBA3ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 32-PowerWFQFN | Tray | Active | - | 40µA | 2.7V ~ 5.5V | -40°C ~ 125°C | Automotive | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |
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MPF5200AMBA1ESPOWER MANAGEMENT IC, PRE-PROG, 3 NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 32-PowerWFQFN | Tray | Active | - | 40µA | 2.7V ~ 5.5V | -40°C ~ 125°C | Automotive | - | Surface Mount, Wettable Flank | 32-HWQFN (5x5) |
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MC33FS6507CAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33PF8101A0ESR2POWER MANAGEMENT IC I.MX8 NON-PR NXP USA Inc. |
0 |
|
![]() Datasheet |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | High Performance i.MX 8 Processor Based | - | 2.5V ~ 5.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |