| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Package/Case | Packaging | Part Status | Part Applications | Current - Supply | Operating Temperature | Grade | Qualification | Mounting Style | Supplier Device Package | Voltage - Supply |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
MC33PF3000A3ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,715 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) | 2.8V ~ 5.5V |
|
MC33PF3000A4ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
2,755 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) | 2.8V ~ 5.5V |
|
MC33PF3000A5ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
3,632 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) | 2.8V ~ 5.5V |
|
MC33PF3000A6ESPOWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
4,895 |
|
Datasheet |
- | 48-VFQFN Exposed Pad | Tray | Active | i.MX Processors | - | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) | 2.8V ~ 5.5V |
|
MC33FS8410G3ESR2SYSTEM BASIS CHIP FS8410 NXP USA Inc. |
2,191 |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MC33FS8410G6ESR2SYSTEM BASIS CHIP FS8410 NXP USA Inc. |
4,233 |
|
- |
* | - | Tape & Reel (TR) | Active | - | - | - | - | - | - | - | - |
|
MFS2603AMDA0ADR2SAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
3,591 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | - | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MFS2633AMBA0ADR2SAFETY SYSTEM BASIS CHIP WITH LO NXP USA Inc. |
3,254 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | 29µA | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) | 3.2V ~ 40V |
|
MC33FS6502NAESYSTEM BASIS CHIP DCDC 0.8A VCO NXP USA Inc. |
2,725 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tray | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |
|
MC33FS4502CAER2SYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
2,149 |
|
Datasheet |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) | 1V ~ 5V |