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+8618924632110（Bella)
+8618924632110（Bella)
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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
940-44-044-17-400004CONN SKT PLCC |
250 |
|
Datasheet |
940 | Tape & Reel (TR) | Active | PLCC | 44 (4 x 11) | Tin | 150.0µin (3.81µm) | - | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | - |
|
917-43-210-41-001000CONN SOCKET TRANSIST TO100 10POS |
440 |
|
Datasheet |
917 | Tube | Active | Transistor, TO-100 | 10 (Round) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Surface Mount | Closed Frame | - | Solder | - | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
123-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
1,098 |
|
Datasheet |
123 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Wire Wrap | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
110-83-316-41-801101CONN IC DIP SOCKET 16POS GOLD |
480 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
XR2P1041CONN SOCKET SIP 10POS GOLD |
795 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 10 (1 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Threaded | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Brass |
|
110-83-640-41-001101CONN IC DIP SOCKET 40POS GOLD |
382 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
540-44-044-17-400004CONN SKT PLCC |
500 |
|
Datasheet |
540 | Tape & Reel (TR) | Active | PLCC | 44 (4 x 11) | Tin | 100.0µin (2.54µm) | - | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | - |
|
|
ICO-308-MGG.100" LOW PROFILE SCREW MACHINE |
112 |
|
Datasheet |
ICO | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester, Glass Filled | 30.0µin (0.76µm) | Brass |
|
|
110-83-320-41-801101CONN IC DIP SOCKET 20POS GOLD |
186 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
299-83-312-11-001101CONN IC DIP SOCKET 12POS GOLD |
202 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 12 (2 x 6) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
940-44-052-17-400004CONN SKT PLCC |
500 |
|
Datasheet |
940 | Tape & Reel (TR) | Active | PLCC | 52 (4 x 13) | Tin | 150.0µin (3.81µm) | - | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Polyphenylene Sulfide (PPS) | 200.0µin (5.08µm) | - |
|
|
ICA-324-SGT.100" SCREW MACHINE DIP SOCKET |
16 |
|
Datasheet |
ICA | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polyester, Glass Filled | 10.0µin (0.25µm) | Brass |
|
|
110-83-964-41-001101CONN IC DIP SOCKET 64POS GOLD |
120 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.9" (22.86mm) Row Spacing | 64 (2 x 32) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
299-83-320-11-001101CONN IC DIP SOCKET 20POS GOLD |
126 |
|
Datasheet |
299 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
HDR-SOICN-80SMT TO SOIC-NARROW HEADER (1.27M |
177 |
|
Datasheet |
- | Bulk | Active | SOIC | 80 (2 x 40) | Gold | 39.4µin (1.00µm) | - | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 130°C | Gold | Polyamide (PA6T), Nylon 6T, Glass Filled | 39.4µin (1.00µm) | - |
|
|
110-41-304-41-001000CONN IC SKT DBL |
102 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
|
HDR-SOICW-80SMT TO SOIC-WIDE HEADER (1.27MM |
194 |
|
Datasheet |
- | Bulk | Active | SOIC | 80 (2 x 40) | Gold | 39.4µin (1.00µm) | - | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -40°C ~ 130°C | Gold | Polyamide (PA6T), Nylon 6T, Glass Filled | 39.4µin (1.00µm) | - |
|
110-13-304-41-001000CONN IC DIP SOCKET 4POS GOLD |
173 |
|
Datasheet |
110 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 10.0µin (0.25µm) | Brass Alloy |
|
117-83-764-41-005101CONN IC DIP SOCKET 64POS GOLD |
439 |
|
Datasheet |
117 | Bulk | Active | DIP, 0.75" (19.05mm) Row Spacing | 64 (2 x 32) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.070" (1.78mm) | Solder | 0.070" (1.78mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
|
614-93-304-41-001000SOCKET CARRIER LOWPRO .300 4POS |
102 |
|
Datasheet |
614 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 4 (2 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
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