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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
508-AG11D-LFIC Socket, DIP8, 8 Contact(s), 2 |
6,542 |
|
- |
* | Tube | Obsolete | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
1-1825094-4CONN IC DIP SOCKET 16POS GOLD |
2,416 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
2-640361-4CONN IC DIP SOCKET 24POS GOLD |
2,397 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 15.0µin (0.38µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic | 15.0µin (0.38µm) | Beryllium Copper |
|
1-1571995-0CONN SOCKET SIP 10POS TIN |
2,735 |
|
Datasheet |
510 | Tube | Obsolete | SIP | 10 (2 x 5) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Thermoplastic, Polyester | 20.0µin (0.51µm) | Copper |
|
714-43-103-31-018000CONN SOCKET SIP 3POS GOLD |
1,358 |
|
Datasheet |
714 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
110-87-322-41-001101CONN IC DIP SOCKET 22POS GOLD |
3,247 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 22 (2 x 11) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
816-AG11D-ESCONN IC DIP SOCKET 16POS GOLD |
4,487 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | 80.0µin (2.03µm) | Copper Alloy |
|
346-93-104-41-013000CONN SOCKET SIP 4POS GOLD |
597 |
|
Datasheet |
346 | Bulk | Active | SIP | 4 (1 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
1825376-2CONN IC DIP SOCKET 28POS GOLD |
3,226 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
210-43-308-41-001IC SOCKET 8-PIN .100" X .300" MA |
779 |
|
- |
210 | Box | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
818-AG11D-ESL-LFCONN IC DIP SOCKET 18POS GOLD |
3,673 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Copper |
|
|
822516-4CONN SOCKET PLCC 52POS TIN |
3,686 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 52 (4 x 13) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Thermoplastic | 100.0µin (2.54µm) | Phosphor Bronze |
|
3-822516-4CONN SOCKET PLCC 52POS TIN |
2,409 |
|
Datasheet |
- | Tape & Reel (TR) | Obsolete | PLCC | 52 (4 x 13) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Thermoplastic | 100.0µin (2.54µm) | Phosphor Bronze |
|
1-1814655-5CONN SOCKET SIP 20POS GOLD |
4,391 |
|
Datasheet |
- | Bulk | Obsolete | SIP | 20 (1 x 20) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Thermoplastic, Polyester | 196.9µin (5.00µm) | Brass |
|
|
818-AG11D-ESLCONN IC DIP SOCKET 18POS GOLD |
4,988 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | Flash | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | 80.0µin (2.03µm) | Copper Alloy |
|
|
4-1571551-2CONN IC DIP SOCKET 8POS GOLD |
3,711 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Nickel |
|
211-1-20-003CONN IC DIP SOCKET 20POS GOLD |
216 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
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|
346-93-105-41-013000CONN SOCKET SIP 5POS GOLD |
261 |
|
Datasheet |
346 | Bulk | Active | SIP | 5 (1 x 5) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
820-AG11D-ESL-LFCONN IC DIP SOCKET 20POS GOLD |
4,592 |
|
Datasheet |
800 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Copper |
|
|
2-1571552-6820-AG11D-ESL-LF=800 DIP GF/SN |
1,260 |
|
Datasheet |
* | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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