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    Home > Products  > Connectors, Interconnects > Sockets for ICs, Transistors > IC Sockets

    IC Sockets

    制造商 Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Product Status Type Number of Positions or Pins (Grid) Pitch - Mating Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Type Features Termination Pitch - Post Contact Finish - Post Contact Finish Thickness - Post Contact Material - Post Housing Material Operating Temperature
    ICA-640-SGT

    ICA-640-SGT

    CONN IC DIP SOCKET 40POS GOLD

    Samtec Inc.

    		 15
    RFQ
    		ICA-640-SGT

    Datasheet

         		ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    115-93-306-41-001000

    115-93-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    		 133
    RFQ
    		115-93-306-41-001000

    Datasheet

         		115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-93-310-41-105000

    110-93-310-41-105000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,148
    RFQ
    		110-93-310-41-105000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-210-41-105000

    110-43-210-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 154
    RFQ
    		110-43-210-41-105000

    Datasheet

         		110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-314-41-105000

    110-43-314-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    		 161
    RFQ
    		110-43-314-41-105000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-43-316-41-105000

    110-43-316-41-105000

    SOCKET IC .300 16POS SMD

    Mill-Max Manufacturing Corp.

    		 173
    RFQ
    		110-43-316-41-105000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder - Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    110-13-310-41-001000

    110-13-310-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    		 956
    RFQ
    		110-13-310-41-001000

    Datasheet

         		110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    210-13-640-41-001000

    210-13-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,135
    RFQ
    		210-13-640-41-001000

    Datasheet

         		210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    299-43-324-11-001000

    299-43-324-11-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    		 176
    RFQ
    		299-43-324-11-001000

    Datasheet

         		299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    1-2397198-1

    1-2397198-1

    SOCKET 4710 FOR ODM

    TE Connectivity AMP Connectors

    		 0
    RFQ

    -

    		 - Tray Active LGA 4710 0.031" (0.80mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount - Solder 0.031" (0.80mm) Tin - Copper Alloy Thermoplastic -40°C ~ 100°C
    1674770-7

    1674770-7

    HARD TRAY ASSY MPGA479M W/TAPE

    TE Connectivity AMP Connectors

    		 6,240
    RFQ
    		1674770-7

    Datasheet

         		- Bulk Active PGA, ZIF (ZIP) 479 (26 x 26) 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.050" (1.27mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic -
    1-390263-1

    1-390263-1

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		1-390263-1

    Datasheet

         		- Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin 60.0µin (1.52µm) Phosphor Bronze - -40°C ~ 105°C
    2-641296-4

    2-641296-4

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		2-641296-4

    Datasheet

         		Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 15.0µin (0.38µm) Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 125°C
    2-382462-3

    2-382462-3

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		2-382462-3

    Datasheet

         		Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -55°C ~ 105°C
    1-390262-1

    1-390262-1

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		1-390262-1

    Datasheet

         		- Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze - -40°C ~ 105°C
    2-382568-0

    2-382568-0

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		2-382568-0

    Datasheet

         		Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic, Glass Filled -55°C ~ 105°C
    02-0518-10

    02-0518-10

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    		 12,441
    RFQ
    		02-0518-10

    Datasheet

         		518 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    2-382465-3

    2-382465-3

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    		 0
    RFQ
    		2-382465-3

    Datasheet

         		Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Thermoplastic -55°C ~ 105°C
    346-43-101-41-013000

    346-43-101-41-013000

    CONN SOCKET SIP 1POS GOLD

    Mill-Max Manufacturing Corp.

    		 1,753
    RFQ
    		346-43-101-41-013000

    Datasheet

         		346 Bulk Active SIP 1 (1 x 1) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Press-Fit 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    211-1-06-003

    211-1-06-003

    CONN IC DIP SOCKET 6POS GOLD

    CNC Tech

    		 7,352
    RFQ
    		211-1-06-003

    Datasheet

         		- Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
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