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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    IC Sockets

    制造商 Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Photo Mfr. Part # Availability Price Quantity Datasheet Series Packaging Part Status Type Number of Positions or Pins (Grid) Contact Finish - Mating Contact Finish Thickness - Mating Contact Material - Mating Mounting Style Features Pitch - Mating Termination Pitch - Post Operating Temperature Contact Finish - Post Housing Material Contact Finish Thickness - Post Contact Material - Post
    ICA-640-SGT

    ICA-640-SGT

    CONN IC DIP SOCKET 40POS GOLD

    Samtec Inc.

    15
    RFQ
    ICA-640-SGT

    Datasheet

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polyester, Glass Filled 10.0µin (0.25µm) Brass
    115-93-306-41-001000

    115-93-306-41-001000

    CONN IC DIP SOCKET 6POS GOLD

    Mill-Max Manufacturing Corp.

    133
    RFQ
    115-93-306-41-001000

    Datasheet

    115 Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-93-310-41-105000

    110-93-310-41-105000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    1,148
    RFQ
    110-93-310-41-105000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin-Lead Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-210-41-105000

    110-43-210-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    154
    RFQ
    110-43-210-41-105000

    Datasheet

    110 Tube Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-314-41-105000

    110-43-314-41-105000

    CONN IC SKT DBL

    Mill-Max Manufacturing Corp.

    161
    RFQ
    110-43-314-41-105000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-43-316-41-105000

    110-43-316-41-105000

    SOCKET IC .300 16POS SMD

    Mill-Max Manufacturing Corp.

    173
    RFQ
    110-43-316-41-105000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder - -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    110-13-310-41-001000

    110-13-310-41-001000

    CONN IC DIP SOCKET 10POS GOLD

    Mill-Max Manufacturing Corp.

    956
    RFQ
    110-13-310-41-001000

    Datasheet

    110 Tube Active DIP, 0.3" (7.62mm) Row Spacing 10 (2 x 5) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    210-13-640-41-001000

    210-13-640-41-001000

    CONN IC DIP SOCKET 40POS GOLD

    Mill-Max Manufacturing Corp.

    1,135
    RFQ
    210-13-640-41-001000

    Datasheet

    210 Tube Active DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 10.0µin (0.25µm) Brass Alloy
    299-43-324-11-001000

    299-43-324-11-001000

    CONN IC DIP SOCKET 24POS GOLD

    Mill-Max Manufacturing Corp.

    176
    RFQ
    299-43-324-11-001000

    Datasheet

    299 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    1-2397198-1

    1-2397198-1

    SOCKET 4710 FOR ODM

    TE Connectivity AMP Connectors

    4,695
    RFQ

    -

    - Tray Active LGA 4710 Gold 30.0µin (0.76µm) Copper Alloy Surface Mount - 0.031" (0.80mm) Solder 0.031" (0.80mm) -40°C ~ 100°C Tin Thermoplastic - Copper Alloy
    1674770-7

    1674770-7

    HARD TRAY ASSY MPGA479M W/TAPE

    TE Connectivity AMP Connectors

    6,240
    RFQ
    1674770-7

    Datasheet

    - Bulk Active PGA, ZIF (ZIP) 479 (26 x 26) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame 0.050" (1.27mm) Solder 0.050" (1.27mm) - Gold Thermoplastic 30.0µin (0.76µm) Copper Alloy
    1-390263-1

    1-390263-1

    CONN IC DIP SOCKET 28POS TIN

    TE Connectivity AMP Connectors

    3,278
    RFQ
    1-390263-1

    Datasheet

    - Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) Tin 60.0µin (1.52µm) Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - 60.0µin (1.52µm) Phosphor Bronze
    2-641296-4

    2-641296-4

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    3,307
    RFQ
    2-641296-4

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 15.0µin (0.38µm) Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 125°C Gold Thermoplastic, Glass Filled 15.0µin (0.38µm) Phosphor Bronze
    2-382462-3

    2-382462-3

    CONN IC DIP SOCKET 8POS TIN

    TE Connectivity AMP Connectors

    4,698
    RFQ
    2-382462-3

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic - Phosphor Bronze
    1-390262-1

    1-390262-1

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    2,570
    RFQ
    1-390262-1

    Datasheet

    - Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) Tin - Phosphor Bronze Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -40°C ~ 105°C Tin - - Phosphor Bronze
    2-382568-0

    2-382568-0

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    2,756
    RFQ
    2-382568-0

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic, Glass Filled - Phosphor Bronze
    02-0518-10

    02-0518-10

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    12,441
    RFQ
    02-0518-10

    Datasheet

    518 Bulk Active SIP 2 (1 x 2) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) - Tin Polyamide (PA46), Nylon 4/6, Glass Filled 200.0µin (5.08µm) Brass
    2-382465-3

    2-382465-3

    CONN IC DIP SOCKET 20POS TIN

    TE Connectivity AMP Connectors

    4,073
    RFQ
    2-382465-3

    Datasheet

    Diplomate DL Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) Tin - Phosphor Bronze Through Hole Closed Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Thermoplastic - Phosphor Bronze
    346-43-101-41-013000

    346-43-101-41-013000

    CONN SOCKET SIP 1POS GOLD

    Mill-Max Manufacturing Corp.

    1,753
    RFQ
    346-43-101-41-013000

    Datasheet

    346 Bulk Active SIP 1 (1 x 1) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - 0.100" (2.54mm) Press-Fit 0.100" (2.54mm) -55°C ~ 125°C Tin Polycyclohexylenedimethylene Terephthalate (PCT), Polyester 200.0µin (5.08µm) Brass Alloy
    211-1-06-003

    211-1-06-003

    CONN IC DIP SOCKET 6POS GOLD

    CNC Tech

    7,352
    RFQ
    211-1-06-003

    Datasheet

    - Tube Active DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame 0.100" (2.54mm) Solder 0.100" (2.54mm) -55°C ~ 105°C Tin Polybutylene Terephthalate (PBT) 200.0µin (5.08µm) Brass
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