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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
822516-2CONN SOCKET PLCC 28POS TIN |
4,095 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 28 (4 x 7) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Thermoplastic | 100.0µin (2.54µm) | Phosphor Bronze |
|
2-641267-1CONN IC DIP SOCKET 28POS TIN |
3,254 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
211-1-08-003CONN IC DIP SOCKET 8POS GOLD |
5,172 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
|
346-93-102-41-013000CONN SOCKET SIP 2POS GOLD |
7,718 |
|
Datasheet |
346 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
346-43-102-41-013000CONN SOCKET SIP 2POS GOLD |
1,776 |
|
Datasheet |
346 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
1-1814655-1CONN SOCKET SIP 16POS GOLD |
5,195 |
|
Datasheet |
- | Bulk | Obsolete | SIP | 16 (1 x 16) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Thermoplastic, Polyester | 196.9µin (5.00µm) | Brass |
|
4-1571552-2CONN IC DIP SOCKET 14POS GOLD |
4,989 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 20.0µin (0.51µm) | Copper |
|
211-1-14-003CONN IC DIP SOCKET 14POS GOLD |
2,465 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
|
714-43-102-31-018000CONN SOCKET SIP 2POS GOLD |
1,956 |
|
Datasheet |
714 | Bulk | Active | SIP | 2 (1 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
808-AG11D-LFCONN IC DIP SOCKET 8POS GOLD |
4,180 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Copper |
|
1571586-2CONN IC DIP SOCKET 8POS TIN |
3,934 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Copper |
|
514-AG11D-ESCONN IC DIP SOCKET 14POS GOLD |
2,128 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester | - | Copper Alloy |
|
643642-8CONN SOCKET SIP 10POS TIN |
2,841 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 10 (1 x 10) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
346-43-103-41-013000CONN SOCKET SIP 3POS GOLD |
962 |
|
Datasheet |
346 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
346-93-103-41-013000CONN SOCKET SIP 3POS GOLD |
436 |
|
Datasheet |
346 | Bulk | Active | SIP | 3 (1 x 3) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
508-AG11D-ESCONN IC DIP SOCKET 8POS GOLD |
2,822 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
1-1825094-3CONN IC DIP SOCKET 14POS GOLD |
3,586 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
211-1-16-003CONN IC DIP SOCKET 16POS GOLD |
2,618 |
|
Datasheet |
- | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polybutylene Terephthalate (PBT) | 200.0µin (5.08µm) | Brass |
|
2-1571551-2CONN IC DIP SOCKET 8POS GOLD |
4,464 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Nickel |
|
2-1571550-2CONN IC DIP SOCKET 8POS GOLD |
3,562 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Beryllium Copper |
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