| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
520-AG11D-ESDIP SOCKET T/H 20POS |
4,403 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | - | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
50950-0084N-0021.27MM PITCH WINBOND SOCKET CONN |
775 |
|
Datasheet |
50950 | Cut Tape (CT) | Active | PLCC | 8 | Tin | 80.0µin (2.03µm) | Copper Alloy | Surface Mount | - | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Thermoplastic | 80.0µin (2.03µm) | Copper Alloy |
|
110-83-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
456 |
|
Datasheet |
110 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | - | Brass |
|
1-1825376-2CONN IC DIP SOCKET 28POS GOLD |
2,277 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
1-1571552-0CONN IC DIP SOCKET 32POS TIN |
2,178 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Copper |
|
4-1571552-6CONN IC DIP SOCKET 20POS GOLD |
2,058 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 20.0µin (0.51µm) | Copper |
|
346-93-109-41-013000CONN SOCKET SIP 9POS GOLD |
175 |
|
Datasheet |
346 | Bulk | Active | SIP | 9 (1 x 9) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
APA-308-T-AADAPTER PLUG |
4,759 |
|
Datasheet |
APA | Bulk | Active | - | 8 (2 x 4) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
APO-308-T-A.100" LOW PROFILE SCREW MACHINE |
3,619 |
|
Datasheet |
APO | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polybutylene Terephthalate (PBT), Glass Filled | - | Phosphor Bronze |
|
714-43-204-31-018000CONN IC DIP SOCKET 4POS GOLD |
1,545 |
|
Datasheet |
714 | Bulk | Active | DIP, 0.1" (2.54mm) Row Spacing | 4 (2 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
|
2-1571551-6CONN IC DIP SOCKET 20POS GOLD |
4,818 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | Flash | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polyester | - | Copper Alloy |
|
824-AG31D-ESCONN IC DIP SOCKET 24POS TINLEAD |
2,233 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin-Lead | - | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
516-AG10D-ESCONN IC DIP SOCKET 16POS GOLD |
3,711 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | - | - | Brass |
|
|
828-AG11D-ESCONN IC DIP SOCKET 28POS GOLD |
3,855 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
9-1437539-1828-AG11D-ES=SOCKET ASSY |
1,245 |
|
Datasheet |
800 | Box | Active | DIP, 0.1" (2.54mm) Row Spacing | 28 (2 x 14) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
210-43-316-41-001SOCKET 16-PIN .100" X .300" MACH |
411 |
|
- |
210 | Box | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 200.0µin (5.08µm) | Brass Alloy |
|
SMPX-84LCC-PSMT PLCC SOCKET 84P POLARISED RO |
195 |
|
Datasheet |
SMPX | Tube | Active | PLCC | 84 (4 x 21) | Tin | 160.0µin (4.06µm) | Phosphor Bronze | Surface Mount | Board Guide, Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -50°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
714-43-108-31-018000CONN SOCKET SIP 8POS GOLD |
646 |
|
Datasheet |
714 | Bulk | Active | SIP | 8 (1 x 8) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 30.0µin (0.76µm) | Brass Alloy |
|
816-AG11DCONN IC DIP SOCKET 16POS GOLD |
3,144 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |
|
1-1437540-7CONN IC DIP SOCKET 40POS GOLD |
2,155 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | - | Polyester | - | - |