| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
SIP1X02-041BLFCONN SOCKET SIP 2POS GOLD |
2,997 |
|
Datasheet |
SIP1x | Bulk | Obsolete | SIP | 2 (1 x 2) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Polyphenylene Sulfide (PPS), Glass Filled | 200.0µin (5.08µm) | Brass |
|
1-1747890-1CONN SOCKET LGA 771POS GOLD |
4,549 |
|
Datasheet |
- | Tray | Obsolete | LGA | 771 (33 x 33) | Gold | - | Copper Alloy | Surface Mount | Open Frame | 0.043" (1.09mm) | Solder | 0.043" (1.09mm) | -25°C ~ 100°C | - | Thermoplastic | - | - |
|
1761503-1CONN SOCKET PGA 940POS GOLD |
2,753 |
|
Datasheet |
- | Tray | Active | PGA | 940 (30 x 30) | Gold | 30.0µin (0.76µm) | - | Surface Mount | Closed Frame | 0.050" (1.27mm) | - | - | - | - | - | - | - |
|
8180-E1CONN TRANSIST TO-3 4POS TIN |
4,120 |
|
Datasheet |
8180 | Bulk | Discontinued at Digi-Key | Transistor, TO-3 | 4 (Oval) | Tin | - | Steel | Through Hole | Closed Frame | - | Solder | - | - | Tin | Polyamide (PA), Nylon, Glass Filled | - | Steel |
|
100-006-050CONN IC DIP SOCKET 6POS GOLD |
4,341 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-008-050CONN IC DIP SOCKET 8POS GOLD |
4,343 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-008-051CONN IC DIP SOCKET 8POS GOLD |
3,693 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-010-050CONN IC DIP SOCKET 10POS GOLD |
3,436 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 10 (2 x 5) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-014-050CONN IC DIP SOCKET 14POS GOLD |
4,099 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-016-050CONN IC DIP SOCKET 16POS GOLD |
2,189 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-016-051CONN IC DIP SOCKET 16POS GOLD |
2,648 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-018-050CONN IC DIP SOCKET 18POS GOLD |
4,676 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-018-051CONN IC DIP SOCKET 18POS GOLD |
4,431 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-020-050CONN IC DIP SOCKET 20POS GOLD |
3,129 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-020-051CONN IC DIP SOCKET 20POS GOLD |
3,352 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-022-050CONN IC DIP SOCKET 22POS GOLD |
2,375 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-024-051CONN IC DIP SOCKET 24POS GOLD |
2,818 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-028-050CONN IC DIP SOCKET 28POS GOLD |
4,965 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-028-051CONN IC DIP SOCKET 28POS GOLD |
2,369 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
100-032-050CONN IC DIP SOCKET 32POS GOLD |
3,952 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |