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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
1825094-3CONN IC DIP SOCKET 14POS GOLD |
3,361 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
8060-1G7CONN TRANSIST TO-5 3POS GOLD |
4,795 |
|
Datasheet |
8060 | Bulk | Active | Transistor, TO-5 | 3 (Round) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | - | Solder | - | -55°C ~ 125°C | Gold | Polytetrafluoroethylene (PTFE) | - | Beryllium Copper |
|
|
2-1571994-0CONN SOCKET SIP 20POS GOLD |
2,892 |
|
Datasheet |
510 | Tube | Obsolete | SIP | 20 (1 x 20) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Thermoplastic, Polyester | 20.0µin (0.51µm) | Copper |
|
|
1825374-3CONN IC DIP SOCKET 14POS GOLD |
4,074 |
|
Datasheet |
Diplomate DL | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
1-822473-1CONN SOCKET PLCC 20POS TIN |
3,695 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | - | Tin | Thermoplastic | 100.0µin (2.54µm) | Phosphor Bronze |
|
|
2-382713-1CONN IC DIP SOCKET 18POS TIN |
4,251 |
|
Datasheet |
Diplomate DL | Box | Active | DIP, 0.6" (15.24mm) Row Spacing | 18 (2 x 9) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
2-382718-8CONN IC DIP SOCKET 28POS TIN |
2,170 |
|
Datasheet |
Diplomate DL | Box | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
|
2-382724-1CONN IC DIP SOCKET 40POS TIN |
2,101 |
|
Datasheet |
Diplomate DL | Box | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Beryllium Copper |
|
|
1571550-7CONN IC DIP SOCKET 22POS TIN |
4,996 |
|
Datasheet |
500 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Beryllium Copper |
|
|
2-1571550-7CONN IC DIP SOCKET 22POS GOLD |
4,673 |
|
Datasheet |
500 | Tube | Active | DIP, 0.4" (10.16mm) Row Spacing | 22 (2 x 11) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Beryllium Copper |
|
|
3-1571550-0CONN IC DIP SOCKET 32POS GOLD |
3,376 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Beryllium Copper |
|
|
3-1571550-1CONN IC DIP SOCKET 36POS GOLD |
3,864 |
|
Datasheet |
500 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Beryllium Copper |
|
|
506-AG11D-ESL-LFCONN IC DIP SOCKET 6POS GOLD |
4,192 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 6 (2 x 3) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Nickel |
|
|
3-1571551-0CONN IC DIP SOCKET 32POS GOLD |
4,369 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | Flash | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Nickel |
|
|
5-1571552-1CONN IC DIP SOCKET 36POS GOLD |
4,265 |
|
Datasheet |
800 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 20.0µin (0.51µm) | Copper |
|
|
824-AG32D-LFCONN IC DIP SOCKET 24POS TIN |
3,220 |
|
Datasheet |
800 | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 24 (2 x 12) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | - | Copper |
|
|
1-1825108-3CONN IC DIP SOCKET 40POS GOLD |
4,307 |
|
- |
Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
3-1825276-2CONN IC DIP SOCKET 32POS GOLD |
3,874 |
|
Datasheet |
Diplomate DL | Tray | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
643645-3CONN SOCKET SIP 13POS TIN |
4,448 |
|
Datasheet |
Diplomate DL | Tray | Obsolete | SIP | 13 (1 x 13) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
|
510-AG90D-10CONN SOCKET SIP 10POS GOLD |
2,617 |
|
Datasheet |
500 | Tube | Obsolete | SIP | 10 (1 x 10) | Gold | - | Beryllium Copper | Through Hole | - | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Thermoplastic | - | Beryllium Copper |
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