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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
69802-120LFCONN SOCKET PLCC 20POS TIN |
4,727 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 20 (4 x 5) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 150.0µin (3.81µm) | Phosphor Bronze |
|
|
69802-168LFCONN SOCKET PLCC 68POS TIN |
4,521 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 68 (4 x 17) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 150.0µin (3.81µm) | Phosphor Bronze |
|
|
814-AG11D-ESL-LFCONN IC DIP SOCKET 14POS GOLD |
3,425 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Copper |
|
|
828-AG11D-ESL-LFCONN IC DIP SOCKET 28POS GOLD |
4,560 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | Flash | Copper |
|
|
4-1571552-4CONN IC DIP SOCKET 16POS GOLD |
4,527 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 20.0µin (0.51µm) | Copper |
|
|
4-1571552-9CONN IC DIP SOCKET 28POS GOLD |
3,954 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 20.0µin (0.51µm) | Copper |
|
|
1-822473-5CONN SOCKET PLCC 52POS TIN |
4,188 |
|
Datasheet |
- | Box | Obsolete | PLCC | 52 (4 x 13) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | - | Tin | Thermoplastic | 100.0µin (2.54µm) | Phosphor Bronze |
|
|
5-1571552-2CONN IC DIP SOCKET 40POS GOLD |
4,078 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 20.0µin (0.51µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin-Lead | Polyester | - | Copper Alloy |
|
|
808-AG11D-ES-LFCONN IC DIP SOCKET 8POS GOLD |
2,827 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 20.0µin (0.51µm) | Copper |
|
|
2-1571586-9CONN IC DIP SOCKET 28POS GOLD |
2,899 |
|
Datasheet |
800 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Copper |
|
|
508-AG10DCONN IC DIP SOCKET 8POS GOLD |
4,018 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | - | 25.0µin (0.63µm) | Copper Alloy |
|
|
516-AG10DCONN IC DIP SOCKET 16POS GOLD |
3,391 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | - | - | - | Brass |
|
|
2-641616-1CONN IC DIP SOCKET 40POS TIN |
2,902 |
|
Datasheet |
Diplomate DL | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic | - | Beryllium Copper |
|
|
5-1571551-0CONN IC DIP SOCKET 32POS GOLD |
2,339 |
|
Datasheet |
500 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Nickel |
|
|
5-1571551-2CONN IC DIP SOCKET 40POS GOLD |
3,987 |
|
Datasheet |
500 | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Nickel |
|
|
4-1571551-4CONN IC DIP SOCKET 16POS GOLD |
4,919 |
|
Datasheet |
500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester | 25.0µin (0.63µm) | Nickel |
|
|
1-1571994-0CONN SOCKET SIP 10POS GOLD |
4,631 |
|
Datasheet |
510 | Tube | Obsolete | SIP | 10 (1 x 10) | Gold | 20.0µin (0.51µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Tin | Thermoplastic, Polyester | 20.0µin (0.51µm) | Copper |
|
|
643648-3CONN SOCKET SIP 16POS TIN |
3,400 |
|
Datasheet |
Diplomate DL | Box | Obsolete | SIP | 16 (1 x 16) | Tin | - | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic, Glass Filled | - | Phosphor Bronze |
|
|
1825373-4CONN IC DIP SOCKET 16POS GOLD |
4,108 |
|
Datasheet |
Diplomate DL | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Thermoplastic, Glass Filled | 15.0µin (0.38µm) | Phosphor Bronze |
|
|
2-641611-1CONN IC DIP SOCKET 18POS TIN |
2,336 |
|
Datasheet |
Diplomate DL | Box | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | Tin | - | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 105°C | Tin | Thermoplastic | - | Beryllium Copper |
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