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IC Sockets
| Photo | Mfr. Part # | Availability | Quantity | Datasheet | Series | Packaging | Part Status | Type | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish Thickness - Mating | Contact Material - Mating | Mounting Style | Features | Pitch - Mating | Termination | Pitch - Post | Operating Temperature | Contact Finish - Post | Housing Material | Contact Finish Thickness - Post | Contact Material - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
100-032-051CONN IC DIP SOCKET 32POS GOLD |
4,653 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-040-050CONN IC DIP SOCKET 40POS GOLD |
3,409 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-040-051CONN IC DIP SOCKET 40POS GOLD |
4,084 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Closed Frame, Seal Tape | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-042-050CONN IC DIP SOCKET 42POS GOLD |
2,195 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
100-048-050CONN IC DIP SOCKET 48POS GOLD |
2,724 |
|
Datasheet |
100 | Bulk | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Gold | 8.00µin (0.203µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -65°C ~ 125°C | Gold | Polyphenylene Sulfide (PPS), Glass Filled | Flash | Brass |
|
|
822516-1CONN SOCKET PLCC 44POS TIN |
2,036 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 44 (4 x 11) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Thermoplastic | 100.0µin (2.54µm) | Phosphor Bronze |
|
|
822516-6CONN SOCKET PLCC 84POS TIN |
3,008 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 84 (4 x 21) | Tin | 100.0µin (2.54µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | - | Tin | Thermoplastic | 100.0µin (2.54µm) | Phosphor Bronze |
|
|
XR2A-2815CONN IC DIP SOCKET 28POS GOLD |
3,931 |
|
Datasheet |
XR2 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
|
XR2C-1511-NCONN SOCKET SIP 15POS GOLD |
2,630 |
|
Datasheet |
XR2 | Bulk | Active | SIP | 15 (1 x 15) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
|
XR2E-3204CONN SOCKET SIP 32POS GOLD |
2,360 |
|
Datasheet |
XR2 | Bulk | Obsolete | SIP | 32 (1 x 32) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 30.0µin (0.76µm) | Beryllium Copper |
|
|
XR2H-1611-NCONN ZIG-ZAG 16POS GOLD |
4,913 |
|
Datasheet |
XR2 | Bulk | Active | Zig-Zag | 16 (2 x 8) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Gold | Polybutylene Terephthalate (PBT), Glass Filled | 10.0µin (0.25µm) | Beryllium Copper |
|
|
2-1814640-0CONN IC DIP SOCKET 16POS TIN |
3,478 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Surface Mount | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -55°C ~ 125°C | Tin | Thermoplastic, Polyester | 200.0µin (5.08µm) | Brass |
|
|
1814654-3CONN IC DIP SOCKET 8POS GOLD |
3,652 |
|
Datasheet |
- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | -55°C ~ 125°C | - | Thermoplastic, Polyester | - | Bronze |
|
|
1-822473-3CONN SOCKET PLCC 32POS TIN |
2,828 |
|
Datasheet |
- | Box | Obsolete | PLCC | 32 (2 x 7, 2 x 9) | Tin | 80.0µin (2.03µm) | Phosphor Bronze | Through Hole | Closed Frame | 0.050" (1.27mm) | Solder | 0.100" (2.54mm) | - | Tin | Thermoplastic | 80.0µin (2.03µm) | Phosphor Bronze |
|
|
1-390262-5CONN IC DIP SOCKET 40POS TIN |
4,186 |
|
Datasheet |
- | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 40 (2 x 20) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | - | 60.0µin (1.52µm) | Phosphor Bronze |
|
|
1-390262-7CONN IC DIP SOCKET 48POS TIN |
4,445 |
|
Datasheet |
- | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 48 (2 x 24) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | - | 60.0µin (1.52µm) | Phosphor Bronze |
|
|
1-390263-2CONN IC DIP SOCKET 32POS TIN |
4,664 |
|
Datasheet |
- | Box | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 32 (2 x 16) | Tin | 60.0µin (1.52µm) | Phosphor Bronze | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | -40°C ~ 105°C | Tin | - | 60.0µin (1.52µm) | Phosphor Bronze |
|
|
210227-4CONN SOCKET PGA 169POS GOLD |
4,985 |
|
Datasheet |
- | Bulk | Active | PGA | 169 (17 x 17) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | 0.100" (2.54mm) | Press-Fit | 0.100" (2.54mm) | - | Tin-Lead | Thermoplastic, Polyester, Glass Filled | 196.9µin (5.00µm) | Phosphor Bronze |
|
|
2-5916783-5CONN SOCKET PGA ZIF 370POS GOLD |
2,931 |
|
- |
- | Tray | Active | PGA, ZIF (ZIP) | 370 (19 x 19) | Gold | 15.0µin (0.38µm) | Copper Alloy | Through Hole | Open Frame | 0.100" (2.54mm) | Solder | 0.100" (2.54mm) | - | Gold | Liquid Crystal Polymer (LCP) | 15.0µin (0.38µm) | Copper Alloy |
|
|
69802-128LFCONN SOCKET PLCC 28POS TIN |
3,704 |
|
Datasheet |
- | Tube | Obsolete | PLCC | 28 (4 x 7) | Tin | 150.0µin (3.81µm) | Phosphor Bronze | Surface Mount | Closed Frame | 0.050" (1.27mm) | Solder | 0.050" (1.27mm) | -55°C ~ 125°C | Tin | Polyphenylene Sulfide (PPS) | 150.0µin (3.81µm) | Phosphor Bronze |
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